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Hi-link surface array semiconductor fingerprint recognition module HLK-ZW0901 capacitive touch fingerprint sensor module test kit/development board

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    $5.28

fingerprint module select list (2)

ZW0901-2

Product introduction

Consumers use fingerprint recognition modules to determine user identity. When the user touches the fingerprint recognition module with his finger, the fingerprint recognition module will

scan the user's fingerprint, and the algorithm chip can obtain the fingerprint image data for registration and comparison.

    

Parameters

Technical indicators


ItemParameter
Storage 

50 fingerprint data as standard

Sensor type                                         Capacitive touch sensor
Resolution                                                       508DPI
FRR.                                                         <3%
FAR.                                                    <0.001%
Fingerprint sensor shape 

round

Image gray level                                              8-bit grayscale
Service life                                              one million times
Static electricity test                      Contact discharge ±8KV/Air discharge ±15KV
Data interface                                             UART (TTL level)
Sensor surface hardness                                                     3H
Working temperature and humidity range                                 -30℃~+70℃; 45%~85%RH
Storage temperature and humidity range                                 -40℃~+85℃; 45%~95%RH

Mechanical characteristics

Project Description Unit
Dimensions Φ12.8mm mm
Ribbon5.6*4.8mm
Sensor size 112*96

Electrical parameters

ItemMin Typical Max Unit
Supply voltage3.03.3 3.6V
Standby current (sensor) -912 μA
Operating current (algorithm MCU) -25 50mA

Picture collection time

150155160
ms
Eigenvalue generation time200220250ms
Comparison time10180400ms
Power-on start time -100-ms
ESD rating

Non-contact discharg

--15KV
Contact discharge--8KV


Application-06


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