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Hi-Link Semiconductor Fingerprint Recognition Module HLK-ZW0905 Capacitive Touch Fingerprint Door Lock Acquisition Sensor Module Test Kit/Development Board

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    $5.28

fingerprint module select list (2)

ZW0905-6

Product introduction

Consumers use fingerprint recognition modules for user identity determination. When the user touches the fingerprint recognition module with his finger, the fingerprint recognition module will

scan the user's fingerprint, and the algorithm chip can obtain the fingerprint image data for registration and comparison.


Parameters

Technical indicators


ItemParameter
Storage 50 pieces
Sensor type Capacitive touch sensor
Resolution 508DPI
FRR. <3%
FAR. <0.001%
Fingerprint sensor shape Round
Image gray level 8-bit grayscale
Service life Amillion times
Static electricity test Contact discharge ±8KV/Air discharge ±15KV
Data interface UART (TTL level)
Sensor surface hardness 3H
Working temperature and humidity range-25℃~+70℃; 45%~85%RH
Storage temperature and humidity range-40℃~+85℃; 45%~95%RH

Mechanical characteristics

Project Description Unit
Dimensions Φ12.8mm mm
Ribbon5.4*4.8mm
Sensor size 112*96

ZW0905-04


Electrical parameters

ItemMin Typical Max Unit
Supply voltage3.03.3 3.6V
Standby current (sensor) 10 12 μA
Operating current (algorithm MCU) 15 25mA
Picture collection time 80100120ms
Generate feature value time 6080100ms
Comparison time100300600ms
Power-on start time -100-ms
ESD rating

Non-contact discharg

-15-KV
Contact discharge-8-KV

Application

Application-06


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